Quote:
Originally posted by codedat
Neuro,
I've done some poking around and IRF has made a revision to the TO-220 packaged MOSFET you have used. I think it is now possible to shrink your design by 40%.
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Power dissipation capability is quite a bit lower with these packages, however. 2W is actually lower than the S08 package is doing (3.5W) It is also much more difficult (if not impossible) to attach a heatsink to that package. I've had the tabs on TO220s get hot enough to melt solder, so I'd like the capability of attaching a heatsink.
Might be good for an "entry level" version of the circuit though.